19 April 2023
Teledyne FLIR—part of Teledyne Technologies—has released development kits for quick integration of the performance-leading FLIR Hadron 640R thermal and visible dual camera module. These hardware and reference software drivers are compatible with development boards supporting the NVIDIA Jetson Nano, the Qualcomm RB5, and the Qualcomm Snapdragon 865. The power of cutting-edge embedded systems can now be quickly unleashed by integrators opening a new world of possibilities and time and cost savings.
The Hadron 640R features a compact 640x512 resolution radiometric Boson thermal camera module providing the ability to see through total darkness, smoke, most fog, and glare, capturing the temperature of every pixel in the scene. The Boson is paired with a 64MP visible electro-optical (EO) camera for high-definition visible imagery. The new development kits enable integrators to start imaging and controlling the cameras within just hours. This significantly reduces development time and costs further making it the ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and AI-ready applications where efficient battery run-time and battery life are mission-critical.
“The powerful Hadron 640R development kits provide integrators industry-leading thermal and visible camera operation using both Linux and Android application development,” said Michael Walters, vice president, product management, Teledyne FLIR. “Combined with the size, weight, and power optimized Hadron 640R and the Teledyne FLIR technical services team to support integration, these development kits further maximize efficiency for developers at every stage.”
Details for Integrators
With low, steady-state power consumption at 1.8W and an IP-54 rating, the Hadron 640R offers extended battery operation time in a compact, lightweight 56-gram camera module. The plug-and-play development solution allows for same-day operation and comes packaged with interface boards, cabling hardware, and reference software drivers. The Teledyne FLIR Hadron 640R development kits are available for purchase globally from Teledyne FLIR and its authorized dealers.
More Kit Information
Hadron 640R development kits pair the performance-leading Hadron 640R with hardware and reference software drivers for quick integration with development boards supporting the Qualcomm RB5, the NVIDIA Jetson Nano, and the Qualcomm Snapdragon 865.
The development kits enable integrators to start imaging and controlling the infrared thermal and visible camera in hours, saving potentially weeks of development time and cost. Hadron 640R includes a 64 MP visible camera and a 640x512 resolution radiometric Boson providing the ability to see through total darkness, smoke, most fog, and glare as well as take the temperature of every pixel in the scene.
With a size, weight, and power (SWaP) optimized design and the rapid development kits, the Hadron 640R is the ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and AI-ready applications where battery life and run-time are mission critical.
PLUG-AND-PLAY DEVELOPMENT SOLUTION. Same-day operation reduce development cost and time to market. PLUS: Includes interface boards and cabling hardware (development board not included); reference drivers available for specified development boards from Avermedia, Lantronix, and Qualcomm; supports Linux and Android
development; US-based technical services team available to support integration.
INDUSTRY-LEADING THERMAL AND VISIBLE CAMERA PERFORMANCE. Collect high-speed, dual VGA radiometric thermal and HD visible imagery. PLUS: 64 MP visible camera resolution; compact, radiometric, 640x512-resolution Boson provides the temperature of every pixel; flexible dual 60 Hz video output via USB or MIPI.
SIZE, WEIGHT, AND POWER OPTIMIZED DESIGN. Extend operation time with compact, lightweight, and low-power Hadron 640R. PLUS: Low, steady state power consumption at 1.8W; IP54-rated dust and water protection; lightweight 56 g enables longer flight time and extends battery life.
Spec Sheet
Specifications are subject to change without notice.
*For plug and play support, the Avermedia D111NO Jetson Nano and Qualcomm RB5 development boards must be used.
About Teledyne FLIR
Teledyne FLIR, a Teledyne Technologies company, is a world leader in intelligent sensing solutions for defense and industrial applications with approximately 4,000 employees worldwide. Founded in 1978, the company creates advanced technologies to help professionals make better, faster decisions that save lives and livelihoods.
